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Fonekong Solder Paste 183°
SKU: FONEKONG
cash on delivery : Yes
₹ 299.00
₹ 399.00
Fonekong Solder Paste 183°
DESCRIPTION:
Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
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Excellent capacity of solder-stickiness
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Excellent Anti-wet Capacity
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Widely used on BGA, PGA, CSP packages and flip chip operation
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Suitable for multiple PCB reflow
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No-clean and Lead free for environmental protection
| Weight | 50.00 gm |
|---|---|
| Length | 5.00 cm |
| Width | 5.00 cm |
| Height | 5.00 cm |
